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Design and fabrication of novel Articulated Robot Arm with mobile movement
(Universiti Malaysia Perlis, 2008-05)
This project had examined the Design and Fabrication of Novel Articulated Robot
Arm with Mobile Movement and Articulated Robot Arm that can perform for Pick and Place function. The project presents the processes undertaken ...
Development of a non-destructive fruit maturity testing system utilizing radio frequency properties
(Universiti Malaysia Perlis, 2008-04)
Microwaves are electromagnetic waves with wavelengths shorter than one meter and longer than one millimeter, or frequencies between 300 megahertz and 300 gigahertz. Microwave usually associated with Radio Frequency. Microwave ...
Floating point multiplication unit using FPGA
(Universiti Malaysia Perlis, 2008-04)
Field-programmable Gate Array (FPGA) is a semiconductor device containing programmable logic components called "logic blocks", and programmable interconnects. Logic blocks can be programmed to perform the function of basic ...
A study of Kaolin as partial replacement in producing concrete brick
(Universiti Malaysia Perlis, 2008-04)
During the nature disaster such as Tsunami, earth quake and flooding, many houses were collapsed and need to be developed back in short time. But the requirement of construction material especially brick or block in one ...
Simulate MIMO channel capacity
(Universiti Malaysia Perlis, 2008-04)
MIMO is defined as Multiple Input Multiple Output systems have multiple antennas at both links at transmitter and receiver. Based on the research that has been done for this project, MIMO system has the capability to ...
Design and simulation of Piezoresistive tactile sensor
(Universiti Malaysia Perlis, 2008-04)
Piezoresistive tactile sensor is use to measure contact force and to characterize surface roughtness of the object. The main application of piezoresistive tactile sensor is in robotic dexterous manipulations tasks. This ...
2.4 Ghz QPSK modulation using MATLAB
(Universiti Malaysia Perlis, 2008-04)
Nowadays when electronics becomes advances in technology, a world become smaller and more easily accessible for the sharing of knowledge and information. Electronic parts are more expected to make our lives easier by showing ...
Developing a mold technology module for freescale – study on effects of materials (compound properties) and molding process parameters on package moldability for QFP
(Universiti Malaysia Perlis, 2008-05)
In integrated circuit (IC) Packaging, there are several processes involved. The main processes for leaded package are wafer mount, wafer saw, die attach, wire bonding,
molding, plating, singulation, trim and form. Molding ...
Effect of Hygrothermal ageing on mechanical properties, swelling behavior and morphology of wood powder filled Low-density Polyethylene (LDPE)
(Universiti Malaysia Perlis, 2008-05)
Effect of hygrothermal ageing on mechanical properties, swelling behavior and morphology of wood powder filled LDPE with different filler loading and addition of coupling agent was investigated and compared with each other. ...
Fuzzy Logic design using VHDL on FPGA
(Universiti Malaysia Perlis, 2008-04)
This fuzzy logic design is to produce 3 outputs from a 7 input. The 7 digital input (3-bits each) is produced from the analogue output of the 7-input honeycomb sensor. The honeycomb sensor receives input from seven sensors ...