Fairul Afzal Ahmad Fuad
http://dspace.unimap.edu.my:80/xmlui/handle/123456789/39204
2024-03-29T01:21:56ZBump height at low temperature analysis
http://dspace.unimap.edu.my:80/xmlui/handle/123456789/35388
Bump height at low temperature analysis
Zaliman, Sauli, Dr.; Retnasamy, Vithyacharan; Fairul Afzal, Ahmad Fuad; Ehkan, Phaklen, Dr.; Steven, Taniselass
The effects of chemical bath time in response to the bump height in electroless nickel immersion gold (ENIG) process was investigated. This paper presents the correlation between electroless process time, immersion gold process time and the bump height. A certain bump height need to be achieved in order to create acceptable solder bumps for reflow process. The study was done using a full factorial design of experiment (DOE). The DOE matrix is made of two levels with two factors. Analysis was done by plotting the main effects plot for each factor. The results suggest that higher process time increases the plating rate where the temperature fixed at 70°C. Electroless nickel time has more influence to the bump height compared to immersion gold time.
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2013-01-01T00:00:00ZShear speed analysis on Sn-3.9Ag-0.6Cu Solder
http://dspace.unimap.edu.my:80/xmlui/handle/123456789/35387
Shear speed analysis on Sn-3.9Ag-0.6Cu Solder
Zaliman, Sauli, Dr.; Retnasamy, Vithyacharan; Fairul Afzal, Ahmad Fuad; Ehkan, Phaklen, Dr.; Ong, Tee Say; Vairavan, Rajendaran
Ball Grid Array (BGA) is a type of semiconductor interconnection used in Integrated Circuit (IC) which is being scaled down to micro and nano size. The reliability of BGA in IC becomes a concern as the size of IC reduces. Hence, this leads to the study of stress on the BGA. This paper discussed the load effects of varying shear speed analysis on the BGA. A Pb-free material, Sn-3.9Ag-0.6Cu solder was applied in the simulation. Shear height value is fixed while the shear speed is varied to investigate the dynamic stress on a BGA package using Ansys software. The results from the graph plotted showed that higher shear speed results to higher shear force.
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2013-01-01T00:00:00Z5mm × 5mm sized slug on high power LED stress and junction temperature analysis
http://dspace.unimap.edu.my:80/xmlui/handle/123456789/35374
5mm × 5mm sized slug on high power LED stress and junction temperature analysis
Zaliman, Sauli, Dr.; Retnasamy, Vithyacharan; Fairul Afzal, Ahmad Fuad; Ehkan, Phaklen, Dr.; Vairavan, Rajendaran; Nazuhusna, Khalid
Conventional incandescent lamps are being replaced by high power light emitting diode as a lighting source due to it ascendancy in terms of physical size, performance, output and lifetime. Nevertheless, the reliability and efficiency of the LED is dependent on the junction temperature. This study presents the thermal simulation of single chip LED package with 5mm ×5mm× 1mm aluminum heat slug. The junction temperature and stress of LED chip were evaluated using Ansys version 11. Input power of 0.1 W and 1 W were applied to the LED. The simulation results showed that at input power of 1W, the maximum junction temperature and stress of the LED chip is 112.91°C and 263.82Mpa respectively.
Link to publisher's homepage at http://www.ttp.net/
2013-01-01T00:00:00ZAluminium surface grain size analysis on RIE treatment
http://dspace.unimap.edu.my:80/xmlui/handle/123456789/35370
Aluminium surface grain size analysis on RIE treatment
Zaliman, Sauli, Dr.; Retnasamy, Vithyacharan; Fairul Afzal, Ahmad Fuad; Ehkan, Phaklen, Dr.; Palianysamy, Moganraj; Aaron, Koay Terr Yeow
Reactive Ion Etch (RIE) has been an important process in the world of microelectronic fabrication. Focus of this preliminary study is on how RIE affects the grain size of aluminum film which is fabricated on substrates. RIE parameters are varied to obtain 16 different recipes which are done using Design of Experiment. Grain size of the samples is recorded for all 16 samples before and after RIE treatment. This produces results that can be compared to obtain the effect of RIE on the aluminum film. Results show that RIE affects the mean grain size of the aluminum film as it increases after RIE treatment.
Link to publisher's homepage at http://www.ttp.net/
2013-01-01T00:00:00Z