Ghulam Abdul Quadir, Prof. Dr.
http://dspace.unimap.edu.my:80/xmlui/handle/123456789/32803
2024-03-28T17:37:13ZPlant based energy potential and biomass utilization in Malaysia
http://dspace.unimap.edu.my:80/xmlui/handle/123456789/34510
Plant based energy potential and biomass utilization in Malaysia
Lee, Koon Ong; Zainal Alimuddin, Zainal Alauddin, Dr.; Ghulam, Quadir, Prof. Dr.; Mohd Zulkifly, Abdullah
The paper assesses the energy productivity of the major plantation crops in Malaysia as well as the status of bioenergy utilization in the country. Of the crops studied and under present local cultivation practices, oil palms and cocoa trees stand out as good trappers of solar energy while paddy plants are the least efficient. Presently Malaysia consumes roughly 2097.8 million GJ of energy per year. Of this amount 14% are contributed by biomass. However of the total amount of biowastes generated in the country roughly 24.5% are utilized for energy purposes while the rest are wasted. They are either left to rot or simply burnt as a means of disposal. If all of these unutilized biomass can be harnessed for use as energy, then the contribution of biomass to the nation's energy consumption can be raised to about 59%, a figure that is indeed attractive and therefore should be given serious attention.
Link to publisher's homepage at http://www.rericjournal.ait.ac.th/index.php/reric
2000-12-01T00:00:00ZTransient analysis of a liquid solar collector
http://dspace.unimap.edu.my:80/xmlui/handle/123456789/33956
Transient analysis of a liquid solar collector
Gyanaprakash, T.; Varadharaju, R.; Kian, Yap Chee; Zainal Alimuddin, Zainal Alauddin, Dr.; Ghulam, Abdul Quadir, Prof. Dr.; Khan, Zahid Akhtar; Aswatha Narayana, P. A.; Seetharamu, Kankanhally N.
An unsteady state analysis of a liquid solar collector is presented. The physical parameters, which govern the system, are identified. The governing equations have been solved using the fourth order Runge-Kutta method for various values of the parameters. The analysis is carried out for both stagnant water and flowing water in the collector. The theoretical predictions compare well with available experimental data.
Link to publisher's homepage at http://www.sciencedirect.com/
2005-01-01T00:00:00ZThermal management of multichipmodule (MCM) using genetic algorithms
http://dspace.unimap.edu.my:80/xmlui/handle/123456789/33954
Thermal management of multichipmodule (MCM) using genetic algorithms
Jeevan, Kanesan; Seetharamu, Kankanhally N.; Ishak, I.A.; Ghulam, Abdul Quadir, Prof. Dr.
The placement of power dissipating chips for a multichip module (MCM) is carried out using genetic algorithms. Since high power is to be dissipated over a small area of a module, the heat must be conducted away efficiently. The main design issue is to achieve uniform thermal distribution. The placement of uniform power dissipating chips is tested using an odd and even number of placement locations. Then the chips with non-uniform power are placed and the results obtained compare well with the force-directed method and quadrisection method.
Link to publisher's homepage at http://ieeexplore.ieee.org/
2003-01-01T00:00:00ZThermal management of multi-chip module and printed circuit board using FEM and genetic algorithms
http://dspace.unimap.edu.my:80/xmlui/handle/123456789/33949
Thermal management of multi-chip module and printed circuit board using FEM and genetic algorithms
Jeevan, Kanesan; Ghulam, Abdul Quadir, Prof. Dr.; Seetharamu, Kankanhally N.; Ishak, Abdul Azid, Dr.
Purpose - To determine the optimal chip/component placement for multi-chip module (MCM) and printed circuit board (PCB) under thermal constraint. Design/methodology/approach - The placement of power dissipating chips/component is carried out using genetic algorithms (GA) in order to achieve uniform thermal distribution on MCM and PCB. The thermal distribution on the MCM and PCB are predicted using 2D-finite element method (FEM) analysis. Different number of chip/component and FEM meshing size is used to investigate the placement of chips/components. Findings - The optimal placement of chip/component using GA is compared well to other placement techniques. The coarse meshing for FEM employed here is found adequate to carry out optimal placement of components by GA. Research limitations/implications - The analysis is valid for constant properties of MCM or PCB and steady state conditions. The chip/component size is limited to a single standard size. Practical implications - The method is very useful for practical design of chip/component placement on MCM/PCB under thermal consideration. Originality/value - FEM analyses of MCM and PCB can be easily implemented in the optimization procedure for obtaining the optimal chip/component placement based on thermal constraints.
Link to publisher's homepage at http://www.emeraldinsight.com/
2005-01-01T00:00:00Z