Research & Innovations
http://dspace.unimap.edu.my:80/xmlui/handle/123456789/2772
2024-03-28T08:44:22ZInternational Engineering Invention & Innovation Exhibition (i-ENVEX) 2015
http://dspace.unimap.edu.my:80/xmlui/handle/123456789/40599
International Engineering Invention & Innovation Exhibition (i-ENVEX) 2015
Anon
ENVEX has been organized since 2009 for internal participants in support of 7-I program. In 2010, ENVEX was opened to national lavel which not only attracted Malaysian participants but also from Saudi Arabia, Thailand and Indonesian universities. 2011 marks a historic moment when ENVEX was rebranded to i-ENVEX and upgraded into an international event. ENVEX young Researcher Club (EYReC) was also established in the same year as an umbrella society to all innovation and invention events. EYReC is also a Perlis Chapter for Malaysian Invention and design Society (MINDS). In 2015, i-ENVEX attacted participations from 10 countries, collecting almost 455 inventions and gathering more than 500 enventors worldwide.
International Engineering Invention & Innovation Exhibition (i-ENVEX) 2015 organized by Envex Young Researcher Club (EYReC), 17-19 April 2015 at Dewan Ilmu, Pauh Putra, Universiti Malaysia Perlis (UniMAP).
2015-04-17T00:00:00ZIn house ARM7 development board
http://dspace.unimap.edu.my:80/xmlui/handle/123456789/40596
In house ARM7 development board
Farid Ros Akmar, Roslim; Ahmad Faris, Hasan; Mohd Fikri, Che Husin; Mohd Hanif, Mohamod Rodili
To develop an ARM7 processor based embedded system with various capabilities and lower cost which are suitable for educational purpose. Develop a simple application test the development board is well function.
The 6th International Engineering Invention & Innovation Exhibition 2015 (i-ENVEX 2015) was organized by ENVEX Young Researcher Club (EYReC), University Malaysia Perlis (UniMAP) and Ministry of Higher Education (MOHE), Malaysia on 17th - 19th April 2015, at UniMAP Main Campus, Pauh Putra, Perlis.
2015-04-17T00:00:00ZNATFAC BREEZE
http://dspace.unimap.edu.my:80/xmlui/handle/123456789/40595
NATFAC BREEZE
Nursyuhada, Mohd Zainuri; Najihah, Azmi; Siti Nur Afiqah, Mohamed
Consists of activated carbon from invasive weed called Imperata Cylindrica or commanly known as Cogon Grass and Bambooseae or known as Bamboo. NATFAC-BREEZE has unique properties that are large surface area, high degree of surface reactivity, universal adsorption effect and favorable pore size. Thus, while other odour control techniques just cover up the smells, NATFAC-BREEZE usually eliminates them permanently.
The 6th International Engineering Invention & Innovation Exhibition 2015 (i-ENVEX 2015) was organized by ENVEX Young Researcher Club (EYReC), University Malaysia Perlis (UniMAP) and Ministry of Higher Education (MOHE), Malaysia on 17th - 19th April 2015, at UniMAP Main Campus, Pauh Putra, Perlis.
2015-04-17T00:00:00ZSAC-SIC : a new potential lead–free composite solder for green technology
http://dspace.unimap.edu.my:80/xmlui/handle/123456789/40545
SAC-SIC : a new potential lead–free composite solder for green technology
Zawawi, Mahim; Sayyidah Amnah, Musa; Noraniza, Saud; Nurul Razliana, Abdul Razak
Recently, the development of Sn-Ag-Cu (SAC) has gain attention in electronic packaging industry due to its good reliability in the electronics application. The tin-silver-copper family of alloys has earned a great deal of positive response from various industry consortia and organizations in resend year and the majority of manufacturers plan on implementing one of these alloys. However, as there are several different alloy formulation within the tin-silver-copper family, background information is necessary to determine which alloy is best suited for the broadest range of applications. Literature has shown that, an attractive and potentially viable method of enhancing the performance of a solder in terms of mechanical and thermal properties is by adding reinforcements to a conventional solder alloy, forming a composite solder. The presence of the second phases such as ceramic reinforcements has been proposed as the potential mechanism controlling reliability of the solder joints, SAC added with SiC particles as reinforcement to developed “ A New Potential Lead-Free Composite Solder For Green Technology” to enhance the physical and mechanical properties of the solder joint. The melting point of this composite solder were slightly increase which will not effect the processing flow in the industry. This superior lead-free composite solder was improved the solderability and mechanical properties compared to current commercial solder of SAC lead-free solder.
The 6th International Engineering Invention & Innovation Exhibition 2015 (i-ENVEX 2015) was organized by ENVEX Young Researcher Club (EYReC), University Malaysia Perlis (UniMAP) and Ministry of Higher Education (MOHE), Malaysia on 17th - 19th April 2015, at UniMAP Main Campus, Pauh Putra, Perlis.
2015-04-17T00:00:00Z