Azmi Kamardinhttp://dspace.unimap.edu.my:80/xmlui/handle/123456789/393192024-03-29T02:28:08Z2024-03-29T02:28:08ZMetallurgical failure analysis of a closed recirculation system water cooling pipeMohd Arif Anuar, Mohd SallehShaiful Rizam, ShamsudinAzmi, KamardinNoor Hamidi, Mohd NoorHafizan, Hassanhttp://dspace.unimap.edu.my:80/xmlui/handle/123456789/348262014-05-29T01:48:06Z2013-01-01T00:00:00ZMetallurgical failure analysis of a closed recirculation system water cooling pipe
Mohd Arif Anuar, Mohd Salleh; Shaiful Rizam, Shamsudin; Azmi, Kamardin; Noor Hamidi, Mohd Noor; Hafizan, Hassan
Catastrophic failure is often associated with a large temperature rise. This situation may lead to a drastic deterioration in material strength where a cooling system is important for a smooth system plant operation to prevent catastrophic failure to its equipments, parts or processes. In this study, a part of a failed closedrecirculation system water cooling pipe in a steel manufacturing plant in Malaysia has been investigated for detailed failure analysis. A steam leakage of a water cooling pipe with a closed recirculation system operation made of ASTM A106/A (Carbon Steel Pipes for high temp service) was detected. The aim of this study is to explore the evidence related to the water cooling pipe leakage and to investigate the cause of failure. Detailed investigation was carried out by visual inspection, optical microscopy and hardness testing. With the evidence obtained, due to presence of water scale and prolonged overheating, decarburization had occurred. During decarburization, it was found that carbon elements from inner surface tube had depleted through the outer tube surface. The accumulation of carbon elements on the outer tube surface appears to show significantly higher brittle zone in the outer tube and with the presence of tensile stress developed from operating thermal cycle which subsequently resulted in crack. It can be concluded that the water cooling pipe leakage was due to thermal fatigue.
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2013-01-01T00:00:00ZCu-SiCp composites as advanced electronic packaging materialsAzmi, KamardinMohd Nazree, Derman, Dr.Mohd Mustafa Al Bakri, AbdullahSandu, A.V.http://dspace.unimap.edu.my:80/xmlui/handle/123456789/345122014-05-19T09:36:39Z2014-01-01T00:00:00ZCu-SiCp composites as advanced electronic packaging materials
Azmi, Kamardin; Mohd Nazree, Derman, Dr.; Mohd Mustafa Al Bakri, Abdullah; Sandu, A.V.
The demand for advanced thermal management materials such as silicon carbide particles reinforced copper matrix (Cu-SiCp) composites is increasing due to the stringent design requirement in the electronic packaging industries. High interest on Cu-SiCp composites is highlighted by the high thermal conductivity and low coefficient of thermal expansion (CTE) properties. However, the thermal properties of the Cu-SiCp composites are constrained by the bonding between the copper matrix and the silicon carbide particles (SiCp) reinforcement. In the powder metallurgical (PM) methodology in particular, the bonding between the two constituents is weak, thus demoting the thermal properties of the Cu-SiCp composites. In order to improve the interface bonding, the SiCp were copper coated via electroless coating process. Based on the experimental results and findings, a continuous copper deposition on the SiCp was obtained via the electroless plating process. The copper film was found to be high in purity and homogeneously deposited on the SiCp surfaces. The CTE values of the Cu-Coated Cu-SiCp composites were found significantly lower than those of the non-Coated Cu-SiCp composites and were in agreement with Kernels model which accounts for both the shear and isostatic stresses developed in the component phases.
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2014-01-01T00:00:00ZSynthesis and characterization of electroless copper coated SiC particlesAzmi, KamardinMohd Arif Anuar, Mohd SallehMohd Nazree, Derman, Dr.http://dspace.unimap.edu.my:80/xmlui/handle/123456789/328132014-03-18T03:36:20Z2013-01-01T00:00:00ZSynthesis and characterization of electroless copper coated SiC particles
Azmi, Kamardin; Mohd Arif Anuar, Mohd Salleh; Mohd Nazree, Derman, Dr.
Silicon carbide reinforced copper matrix (Cu-SiCp) composites fabricated via the conventional powder metallurgy methods have inferior thermophysical properties due to the weak bonding between the copper matrix and the SiCp reinforcement. In order to improve the bonding between the two constituents, the SiCp were copper coated via electroless coating process. Based on the experimental results and findings, a continuous copper deposition on the SiCp was obtained via the electroless plating process. The copper film was found to be high in purity and homogeneously deposited on the SiCp surfaces. The thickness of the coated copper layer was roughly estimated to be around 1μm.
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2013-01-01T00:00:00ZThe thermal expansion behaviors of Cu-SiCp compositesAzmi, KamardinMohd Nazree, Derman, Dr.Mohd Mustafa Al-Bakri, Abdullahhttp://dspace.unimap.edu.my:80/xmlui/handle/123456789/328122014-03-18T03:23:44Z2013-01-01T00:00:00ZThe thermal expansion behaviors of Cu-SiCp composites
Azmi, Kamardin; Mohd Nazree, Derman, Dr.; Mohd Mustafa Al-Bakri, Abdullah
The demand for advanced thermal management materials such as silicon carbide reinforced copper matrix (Cu-SiCp) composites is increasing due to their high thermal conductivity and low CTE properties. However, the weak bonding between the copper matrix and the SiCp reinforcement degrades the thermophysical properties of the composites. In order to improve the bonding between the two constituents, the SiCp were copper coated (Cu-Coated) via electroless coating process. Based on the experimental results, the CTE values of the Cu-Coated Cu-SiCp composites were found significantly lower than those of the non-Coated Cu-SiCp composites. The CTEs of the Cu-Coated Cu-SiCp composites were in agreement with Kernel's model which accounts for both the shear and isostatic stresses developed in the component phases
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2013-01-01T00:00:00Z