Nooraihan Abdullah, Dr.This page provides access to scholarly publications by UniMAP Faculty members and researchershttp://dspace.unimap.edu.my:80/xmlui/handle/123456789/392592024-03-28T17:31:39Z2024-03-28T17:31:39ZNuclear matter and surface clusteringQamar Nasir, Usmani, Prof. Dr.Nooraihan, AbdullahKhairul Anwar, Mohamad KhazaliZaliman, Sauli, Dr.http://dspace.unimap.edu.my:80/xmlui/handle/123456789/356102014-06-17T08:48:39Z2013-01-01T00:00:00ZNuclear matter and surface clustering
Qamar Nasir, Usmani, Prof. Dr.; Nooraihan, Abdullah; Khairul Anwar, Mohamad Khazali; Zaliman, Sauli, Dr.
We demonstrate that the binding energy per nucleon of symmetric nuclear matter (SNM) (with Coulomb interaction switched off and N Z) in the limit of zero density approaches to its value, uv, at the saturation density, where uv is the volume term of the Weizsäcker mass formula. This phenomenon is a direct result of the clustering of nuclei in the low density region of nuclear matter. We study the implications of this result on the properties of nuclei. We also study the properties of asymmetric nuclear matter. Because of clustering a provocative interpretation of the equation of state of asymmetric nuclear matter emerges which is at considerable variance at low densities with hitherto all the previous calculations. For nuclei, as a framework, an extended version of Thomas-Fermi theory is invoked. Calculations are performed for 2149 nuclei with N, Z ≥ 8. The present scheme leads to a forceful interpretation of the low density asymmetry energy data of Natowitz et al.
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2013-01-01T00:00:00ZSurface roughness and wettability correlation on etched platinum using reactive ion ecthingZaliman, Sauli, Dr.Retnasamy, VithyacharanAaron, Koay Terr YeowGoh, Siew ChuiKhairul Anwar, Mohamad KhazaliNooraihan, Abdullahhttp://dspace.unimap.edu.my:80/xmlui/handle/123456789/336952014-04-14T13:43:26Z2014-01-01T00:00:00ZSurface roughness and wettability correlation on etched platinum using reactive ion ecthing
Zaliman, Sauli, Dr.; Retnasamy, Vithyacharan; Aaron, Koay Terr Yeow; Goh, Siew Chui; Khairul Anwar, Mohamad Khazali; Nooraihan, Abdullah
As the world of semiconductor is moving towards smaller and high-end applications, the quality of the bonding adhesion for wire bonding is very critical. Although aluminium has been the metallization of choice in integrated circuits, it can be easily oxidized during high temperature and pressure. On the other hand, Platinum metallization layer has high thermal coefficient resistance and inert to oxygen. This paper reports the correlation between surface roughness and the wettability in the form of contact angle for Platinum deposited wafer etched using Inductively Couple Plasma-Reactive Ion Etching (ICP-RIE). Surface roughness was measured using AFM while contact angle was obtained via droplet test. The results clearly suggested that both surface roughness and wettabily, calculated by its contact angle value has the same trend. Surface roughness is directly proportional to the contact angle. This indicates that surface roughness have great influence on the surface wettability. Therefore, the adhesion for wire bonding process on platinum metallization which can be used in high end applications can be controlled by its surface roughness and wettability.
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2014-01-01T00:00:00ZNatural heat convection analysis on cylindrical Al slug of LEDVairavan, RajendaranZaliman, Sauli, Dr.Retnasamy, VithyacharanKhairul Anwar, Mohamad KhazaliNooraihan, AbdullahNazuhusna, Khalidhttp://dspace.unimap.edu.my:80/xmlui/handle/123456789/336942014-04-14T13:35:28Z2014-01-01T00:00:00ZNatural heat convection analysis on cylindrical Al slug of LED
Vairavan, Rajendaran; Zaliman, Sauli, Dr.; Retnasamy, Vithyacharan; Khairul Anwar, Mohamad Khazali; Nooraihan, Abdullah; Nazuhusna, Khalid
This paper presents the characterization of a single chip high power LED package through simulation. Ansys version 11 was used for the simulation. The characterization of the LED package with aluminum cylindrical heat slug was carried out under natural convection condition at ambient temperature of 25°C. The junction temperature and the stress of the LED chip was assesed. The LED chip was powered with input power of 0.1 W and 1 W and the heat dissipation was assesed. Results showed that that the junction temperature and the Von Mises Stress of the single chip LED package increases with the increased input power.
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2014-01-01T00:00:00ZBaₓSr₁-ₓ TiO₃ different thickness analysis using sol gel approachNurhafizah, RamliZaliman, Sauli, Dr.Retnasamy, VithyacharanThey, Yee ChinKhairul Anwar, Mohamad KhazaliNooraihan, Abdullahhttp://dspace.unimap.edu.my:80/xmlui/handle/123456789/336912014-04-14T13:13:27Z2014-01-01T00:00:00ZBaₓSr₁-ₓ TiO₃ different thickness analysis using sol gel approach
Nurhafizah, Ramli; Zaliman, Sauli, Dr.; Retnasamy, Vithyacharan; They, Yee Chin; Khairul Anwar, Mohamad Khazali; Nooraihan, Abdullah
Barium Strontium Titanate (BST) a common topic in the microelectronic field for many devices which is mainly on dynamic random access memories (DRAM). There are many methods of preparing BaₓSr₁-ₓTiO3; barium strontium titanate. In this work, sol-gel method was used as it has some advantages like better homogeneity, lower cost, lower processing temperature and easier fabrication. BaₓSr₁-ₓTiO3 solution was deposited on the silicon substrate of 4 different thicknesses with different ratio of the concentration of Barium (Ba). The thickness of the thin film has a linear increase as the Ba content increases.
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2014-01-01T00:00:00Z