Zaliman Sauli, Lt. Kol. Professor Dr.This page provides access to scholarly publications by UniMAP Faculty members and researchers.http://dspace.unimap.edu.my:80/xmlui/handle/123456789/392562024-03-29T09:45:43Z2024-03-29T09:45:43ZLED heat dissipation analysis using composite based cylindrical slugZaliman, Sauli, Dr.Vairavan, RajendaranRetnasamy, Vithyacharanhttp://dspace.unimap.edu.my:80/xmlui/handle/123456789/391282015-03-06T09:11:17Z2014-02-01T00:00:00ZLED heat dissipation analysis using composite based cylindrical slug
Zaliman, Sauli, Dr.; Vairavan, Rajendaran; Retnasamy, Vithyacharan
The optical efficacy and reliability of light emitting diode is extensively influenced by the operating junction temperature of the LED. Therefore, the evaluation of junction temperature is significant. This paper reports a simulation analysis on the heat dissipation of single chip LED package with based material, copper diamond (Cu/Dia) cylindrical heat slug.Ansys version 11 was utilized as the simulation platform. The junction temperature and stress of the LED chip under natural convection condition were evaluated with varied input power of 0.1 W, 0.5 W and 1 W. Results indicated the maximum junction temperature of LED chip was attained at input power of 1 W.
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2014-02-01T00:00:00ZEffects of heat slug shapes on the heat dissipation of high power LEDZaliman, Sauli, Dr.Vairavan, Rajendaran;Retnasamy, Vithyacharanhttp://dspace.unimap.edu.my:80/xmlui/handle/123456789/390662015-03-04T08:52:01Z2014-02-01T00:00:00ZEffects of heat slug shapes on the heat dissipation of high power LED
Zaliman, Sauli, Dr.; Vairavan, Rajendaran;; Retnasamy, Vithyacharan
High power light emitting diodes are currently challenged by thermal issue of high heat generation which limits the reliability and efficiency. Each component in the LED package has a significant role in heat dissipation. In this paper, a simulation study was done to scrutinize the influence of heat slug shape on the heat dissipation of single chip LED package using Ansys version 11. Two types of heat slug shapes, rectangular and cylindrical were used. The analysis was carried out under natural convection condition at ambient temperature of 25°C. Simulated results indicate that rectangular shape heat slug exhibits better heat dissipation.
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2014-02-01T00:00:00ZWettability and surface roughness study on RIE treated aluminium deposited surfaceRetnasamy, VithyacharanZaliman, Sauli, Dr.Uda, Hashim, Prof. Dr.Palianysamy, MoganrajAaron, Koay Terr YeowRamzan, Mat Ayubhttp://dspace.unimap.edu.my:80/xmlui/handle/123456789/389912015-02-23T13:23:37Z2014-04-01T00:00:00ZWettability and surface roughness study on RIE treated aluminium deposited surface
Retnasamy, Vithyacharan; Zaliman, Sauli, Dr.; Uda, Hashim, Prof. Dr.; Palianysamy, Moganraj; Aaron, Koay Terr Yeow; Ramzan, Mat Ayub
Design of Experiment (DOE) is a technique for optimizing process which has controllable inputs and measurable outputs. As a method of DOE, 24 Full Factorial design is used to study the effect of Reactive Ion Etch towards the surface roughness of aluminum pad and effect of the roughness produced towards the contact angle. Surface roughness analysis is done using Atomic Force Microscop (AFM). Contact angle is measured using AutoCad software from the images captured from droplet test. This contact angles must be more than 90° for non-wetting profile or less than 90° for wetting profile. This work is also done to understand the interaction between the process parameters and how each parameters will affect the etch rate. The results are analyzed which shows that the increase in surface roughness produces an increase on the contact angle and vice versa.
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2014-04-01T00:00:00ZHeat dissipation analysis under natural convection condition on high power LEDVairavan, RajendaranZaliman, Sauli, Dr.Retnasamy, VithyacharanKamarudin, Hussin, Brig. Jen. Dato' Prof. Dr.http://dspace.unimap.edu.my:80/xmlui/handle/123456789/356642014-06-18T01:53:05Z2013-10-01T00:00:00ZHeat dissipation analysis under natural convection condition on high power LED
Vairavan, Rajendaran; Zaliman, Sauli, Dr.; Retnasamy, Vithyacharan; Kamarudin, Hussin, Brig. Jen. Dato' Prof. Dr.
As the technology downscales with superior power and increased package density, the thermal effects of the high power LED are significant. Thus, the operating junction temperature of the high power light emitting diodes has to be reduced. In this paper, evaluation on single chip high power light emitting was done. The prime motive of this work was to assess the effect of heat slug size on the junction temperature and stress of LED chip under natural convection condition at ambient temperature of 25°C. Two sizes of rectangular heat slug were used. Simulation was carried out using Ansys version 11. Input power of 0.1W and 1W was applied to LED. Simulated results indicated that a larger slug size is favorable for a lower operating junction temperature and stress of the LED chip.
Link to publisher's homepage at http://www.aensiweb.com/
2013-10-01T00:00:00Z