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iRepository at Perpustakaan UniMAP >
Items for Author "Ibrahim, Ahmad"
Showing 7 items.
| Issue Date | Title | Author(s) |
| 2007 |
The characterization of Al Bond pad surface treatment in Electroless Nickel Immersion Gold (ENIG) deposition |
Mohd Khairuddin, Md Arshad; Azman, Jalar; Ibrahim, Ahmad; Ghazali, Omar |
| 2007 |
Characterization of parasitic residual deposition on passivation layer in electronics nickel immersion gold process |
Mohd Khairuddin, Md Arshad; Azman, Jalar; Ibrahim, Ahmad |
| 6-Dec-2005 |
The effect of temperature, pH and exposure time to Electroless Nickel Deposition for Under Bump Metallurgy (UBM) |
Mohd Khairuddin, Md Arshad; Ibrahim, Ahmad; Azman, Jalar; Uda, Hashim |
| Sep-2006 |
The effects of multiple zincation process on Aluminum Bond Pad surface for Electroless Nickel Immersion Gold deposition |
Mohd Khairuddin, Md Arshad; Ibrahim, Ahmad; Azman, Jalar; Ghazali, Omar; Uda, Hashim |
| 2006 |
Simulasi Fabrikasi Simpangan Cetek Ultra menggunakan Resapan Dopan daripada SOD (Spin On Dopant) |
Uda, Hashim; Nik Hazura, Nik Hamat; Fauziyah, Salehuddin; Ibrahim, Ahmad; Sutikno Madnasri |
| 28-Jun-2010 |
A study for optimum productivity yield in 0.16μm mixed of wafer fabrication facility |
Mohd Azizi, Chik; Ve, Chun Yung; Balakrishna, Puvaneswaran; Uda, Hashim, Prof. Dr.; Ibrahim, Ahmad; Bashir, Mohamad |
| 2006 |
The surface characteristics of under bump metallurgy (UBM) in electroless nickel immersion gold (ENIG) deposition |
Mohd Khairuddin, Md Arshad; Ibrahim, Ahmad; Azman, Jalar; Ghazali, Omar |
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