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Please use this identifier to cite or link to this item: http://dspace.unimap.edu.my:80/xmlui/handle/123456789/9705

Title: Wafer bumping: A comparative technologies study
Authors: Mohd Khairuddin, Md Arshad
Keywords: Environ -- Penerbitan Universiti;UniMAP -- Publications;UniMAP -- Pusat Pengajian Kejuruteraan Alam Sekitar;UniMAP -- Research and development;Under bump metallurgy (UBM);Wafer bumping
Issue Date: Jun-2006
Publisher: Universiti Malaysia Perlis (UniMAP)
???metadata.dc.publisher.department???: Pejabat Timbalan Naib Canselor (Penyelidikan dan Inovasi)
Citation: p.4-5
Series/Report no.: Explore
June 2006
URI: http://hdl.handle.net/123456789/9705
ISSN: 1823-9633
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