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Please use this identifier to cite or link to this item:
http://hdl.handle.net/123456789/9705
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| Title: | Wafer bumping: A comparative technologies study |
| Authors: | Mohd Khairuddin, Md Arshad |
| Keywords: | Environ -- Penerbitan Universiti
UniMAP -- Publications
UniMAP -- Pusat Pengajian Kejuruteraan Alam Sekitar
UniMAP -- Research and development
Under bump metallurgy (UBM)
Wafer bumping |
| Issue Date: | Jun-2006 |
| Publisher: | Universiti Malaysia Perlis (UniMAP) |
| Department: | Pejabat Timbalan Naib Canselor (Penyelidikan dan Inovasi) |
| Citation: | p.4-5 |
| Series/Report no.: | Explore
June 2006 |
| URI: | http://hdl.handle.net/123456789/9705 |
| ISSN: | 1823-9633 |
| Appears in Collections: | Publications
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