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Please use this identifier to cite or link to this item: http://dspace.unimap.edu.my:80/dspace/handle/123456789/9170

Title: High degree of testability using full scan chain and ATPG-An industrial perspective
Authors: Mamun, Ibne Reaz
Lee, W. F.
Hamid, N. H.
Lo, H. H.
Ali Yeon, Mohd Shakaff, Prof. Dr.
Keywords: Automatic test pattern generation;Design for test;DFT design methodology;Guideline;IC chip packaging;Integrated circuit;Scan chain;Sharing pin for testing;VLSI
Issue Date: 2009
Publisher: Asian Network for Scientific Information
Citation: Journal of Applied Sciences, vol. 9(14), 2009, pages 2613-2618
Abstract: This study describes an efficient design methodology from an industrial perspective on utilizing Register Transfer Level (RTL) coding style, full scan chain implementation and Automatic Test Pattern Generation (ATPG) to achieve a high percentage of testability in the final Integrated Circuit (IC). The design methodology involves using an ASIC design flow with scan insertion and scan stitching performed after synthesis with scan flops set as don’t_use during synthesis process. Based on this method of ASIC design flow with the RTL coding style and guideline, an in-house 64 bit processor core that executes 3 instructions per cycle, is implemented with 0.35 micron process technology with a single scan chain of 4600 flip-flops, achieving an ATPG pattern for stuck-at at 100% test coverage and 99.81% fault coverage. Thus, creating high testability coverage with the ATPG pattern can be achieved by having a fully synchronous design using the proposed RTL coding style and full scan chain implementation. This study also describes the work around methods used when dealing with cost reduction involving reduction of test pin on the IC chip package.
Description: Link to publisher's homepage at www.ansinet.com/
URI: http://www.scialert.net/pdfs/jas/2009/2613-2618.pdf
http://hdl.handle.net/123456789/9170
ISSN: 1812-5654
Appears in Collections:School of Mechatronic Engineering (Articles)
Ali Yeon, Md Shakaff, Prof. Dr.

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