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| Title: | Fabrication of titanium carbide reinforced copper matrix composite by in-situ processing |
| Authors: | Nur Hawadah, Mohd Subhi
Zuhailawati, Hussain
Radzali, Othman |
| E-mail: | zuhaila@eng.usm.my |
| Keywords: | Mechanical alloying
In-situ composite
Phase analysis
Composite materials
Mechanical alloying (MA)
International Conference on X-Rays & Related Techniques in Research & Industry (ICXRI) |
| Issue Date: | 9-Jun-2010 |
| Publisher: | Universiti Malaysia Perlis |
| Department: | School of Materials Engineering & School of Environmental Engineering |
| Citation: | p.74-81 |
| Series/Report no.: | Proceedings of the International Conference on X-Rays & Related Techniques in Research & Industry (ICXRI) 2010 |
| Abstract: | Composite materials with copper matrix and ceramic particle reinforcements provide an alternative material for scope for producing relatively high thermal conductivity, electrical conductivity and hardness properties. Most of the work on copper-based composites has involved TiC reinforcement, which is introduced in the copper matrix through a powder metallurgy (P/M) route. TiC particle is an interesting candidate for the reinforcement of the Cu composite because of its high melting point, high hardness, good oxidation and corrosion resistance combined with good electrical and thermal conductivity. In this study, in-situ prepared copper-titanium carbide using high energy ball milling was addressed. Cu-Ti-C mixture powder was mechanically alloyed by high energy ball milling at 400 rpm speed for 4 to 80 hours to investigate the formation of TiC phase during milling. From the XRD result, after 5 h milling, TiC peak was found at 36.3° and 60.9°. |
| Description: | International Conference on X-Rays and Related Techniques in Research and Industry (ICXRI 2010) jointly organized by Universiti Malaysia Perlis (UniMAP) and X-Ray Application Malaysia Society (XAPP), 9th - 10th June 2010 at Aseania Resort Langkawi, Malaysia. |
| URI: | http://hdl.handle.net/123456789/9059 |
| ISBN: | 978-967-5760-02-0 |
| Appears in Collections: | Conference Papers
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