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|Title: ||The effects of autocatalyst copper coating of SiCp on the microstructure of CuSiCp composites|
|Authors: ||Azmi, Kamardin|
Mohd Nazree, Derman
Shaiful Rizam Shamsudin
Mazlee, Mohd Noor
|Keywords: ||Autocatalyst copper plating;Silicon carbide reinforced copper matrix composites;Interfacial interaction;Thermal treatment;Materials engineering;Composite materials|
|Issue Date: ||1-Dec-2009|
|Publisher: ||Universiti Malaysia Perlis|
|Series/Report no.: ||Proceedings of the Malaysian Metallurgical Conference '09 (MMC'09)|
|Abstract: ||In this paper, the autocatalyst copper coating (ACC) of silicon carbide particle
(SiCp) was performed after a sequence of surface treatment, sensitization and
surface activation processes. The ACC process was operated at pH of 12.5 and
75oC. Later, the copper coated SiCp were mixed with copper powders at 20 vol.%
and sintered at 1025oC for 0.5, 2 and 4 hours under a controlled argon atmosphere.
The composition and microstructure of the copper deposited layer were examined by
means of energy dispersive x-ray (EDX) analysis and scanning electron microscopy
(SEM) respectively. The experiment shows that the ACC process gives an excellent
copper plating coverage with uniform plating thickness on the SiCp. More importantly,
the copper coated layer manages to control the interfacial reactions between the SiC
reinforcement and copper matrix.|
|Description: ||Organized by School of Materials Engineering & Sustainable Engineering Research Cluster, 1st - 2nd December 2009 at Putra Brasmana Hotel, Kuala Perlis, Perlis.|
|Appears in Collections:||Azmi Kamardin|
Mohd Nazree Derman, Dr.
Mazlee Mohd Noor, Dr.
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