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Title: The effects of autocatalyst copper coating of SiCp on the microstructure of CuSiCp composites
Authors: Azmi, Kamardin
Mohd Nazree, Derman
Shaiful Rizam Shamsudin
Mazlee, Mohd Noor
J.A.H., Iqwan
???metadata.dc.contributor.url???: azmikamardin@unimap.edu.my
Keywords: Autocatalyst copper plating;Silicon carbide reinforced copper matrix composites;Interfacial interaction;Thermal treatment;Materials engineering;Composite materials
Issue Date: 1-Dec-2009
Publisher: Universiti Malaysia Perlis
Citation: p.1-
Series/Report no.: Proceedings of the Malaysian Metallurgical Conference '09 (MMC'09)
Abstract: In this paper, the autocatalyst copper coating (ACC) of silicon carbide particle (SiCp) was performed after a sequence of surface treatment, sensitization and surface activation processes. The ACC process was operated at pH of 12.5 and 75oC. Later, the copper coated SiCp were mixed with copper powders at 20 vol.% and sintered at 1025oC for 0.5, 2 and 4 hours under a controlled argon atmosphere. The composition and microstructure of the copper deposited layer were examined by means of energy dispersive x-ray (EDX) analysis and scanning electron microscopy (SEM) respectively. The experiment shows that the ACC process gives an excellent copper plating coverage with uniform plating thickness on the SiCp. More importantly, the copper coated layer manages to control the interfacial reactions between the SiC reinforcement and copper matrix.
Description: Organized by School of Materials Engineering & Sustainable Engineering Research Cluster, 1st - 2nd December 2009 at Putra Brasmana Hotel, Kuala Perlis, Perlis.
URI: http://hdl.handle.net/123456789/7540
Appears in Collections:Mohd Nazree Derman, Dr.
Mazlee Mohd Noor, Dr.
Conference Papers

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