DSpace
 

iRepository at Perpustakaan UniMAP >
The Library >
Conference Papers >

Please use this identifier to cite or link to this item: http://dspace.unimap.edu.my:80/dspace/handle/123456789/7233

Title: Simulation of an automated blanking, stamping and bending process using automation studio for industrial application
Authors: L. Abdullah
P. B. Tiew
P. L. Soh
Keywords: Automation system;Automation;Manufacturing processes -- Automation;Automation system -- Design and construction
Issue Date: 11-Oct-2009
Publisher: Universiti Malaysia Perlis
Citation: p.8A 1 - 8A 6
Series/Report no.: Proceedings of International Conference on Applications and Design in Mechanical Engineering 2009 (iCADME 2009)
Abstract: The paper deals with a design of an automation system that performs blanking, stamping and bending processes for industrial purposes. The system consists of three machines and a chain conveyor controlled by a programmable logic controller (PLC). The basic automation components that are used in the present study are proximity sensor, limit switch, timers and others while Automation Studio Software is used to test the system on PLC program. The Solid Works software is also used to sketch the simple 3D drawing to enhance the visualization of the whole system.
Description: Organized by School of Mechatronic Engineering (UniMAP) & co-organized by The Institution of Engineering Malaysia (IEM), 11th - 13th October 2009 at Batu Feringhi, Penang, Malaysia.
URI: http://hdl.handle.net/123456789/7233
ISBN: 978-967-5415-07-4
Appears in Collections:Conference Papers

Files in This Item:

File Description SizeFormat
Simulation of an Automated Blanking, Stamping and.pdfAccess is limited to UniMAP community.1.18 MBAdobe PDFView/Open
View Statistics

Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.

 

Valid XHTML 1.0! Perpustakaan Tuanku syed Faizuddin Putra, Kampus Pauh Putra, Universiti Malaysia Perlis, 02600, Arau Perlis
TEL: +604-9885420 | FAX: +604-9885405 | EMAIL: rujukan@unimap.edu.my Feedback