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Please use this identifier to cite or link to this item: http://dspace.unimap.edu.my:80/dspace/handle/123456789/6615

Title: The surface morphology characterization of electroless nickel immersion gold under bump metallurgy (UBM) using SEM
Authors: Mohd Khairuddin, Md Arshad
Mohd Nazrin, Md Isa
Sohiful Anuar, Zainol Murad
Keywords: Electroless nickel immersion gold (ENIG);Scanning electron microscope (SEM);Under bump metallurgy (UBM);Surface morphology;Surface roughness;Zincation;Electroless deposition
Issue Date: 9-May-2007
Publisher: American Institute of Physics
Citation: AIP Conf. Proc., p.118-123
Series/Report no.: Proceedings of the 2nd International Conference on Solid State Science and Technology 2006 (ICSSST 2006)
Abstract: This paper presents the surface morphology characterization at each process step in electroless nickel immersion gold (ENIG) deposition using Scanning Electron Microscope (SEM). The characterization start at initial bond pad, followed by cleaning, activation, first zincation, zinc removal, second zincation, electroless nickel and lastly immersion gold process. The result shows that the surface morphology of initial bond pad starts to change with deposition of zinc layer and further changes with deposition of nickel and gold layer.
Description: Link to publisher's homepage at http://link.aip.org/link/?APCPCS/909/118/1
URI: http://link.aip.org/link/?APCPCS/909/118/1
http://hdl.handle.net/123456789/6615
Appears in Collections:School of Microelectronic Engineering (Articles)

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