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|Title: ||The effect of temperature, pH and exposure time to Electroless Nickel Deposition for Under Bump Metallurgy (UBM)|
|Authors: ||Mohd Khairuddin, Md Arshad|
|Keywords: ||Under bump metallurgy (UBM);Wafer bumping;Electroless nickel immersion gold (ENIG);Surface roughness;Electroless deposition;Nickel-plating|
|Issue Date: ||6-Dec-2005|
|Publisher: ||Universiti Putra Malaysia (UPM)|
|Series/Report no.: ||International Advanced Technology Congress|
|Abstract: ||The low cost deposition of under bump metallurgy (UBM) method presented in this paper is based on electroless nickel immersion gold (ENIG) bumping process. The study is focuses on the effect of temperature, pH and exposure time to the deposition of nickel thickness. Metallurgical cross-section and image capturing system were used as analytical tools. Result suggests that with the increase of temperature, pH and exposure time, the nickel thickness also increased.|
|Description: ||Organized by Universiti Putra Malaysia (UPM), 6th - 8th December 2005 at Putra World Trade Centre (PWTC), Kuala Lumpur.|
|Appears in Collections:||Conference Papers|
Uda Hashim, Prof. Dr.
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