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Please use this identifier to cite or link to this item:
http://hdl.handle.net/123456789/5506
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| Title: | Aging effect of Sn-Ag-Cu lead free solder |
| Authors: | Mohd Jeffry, Radzi |
| Advisors: | Nor Azwin Ahad |
| Keywords: | Alloys
Solder and soldering
Solder pastes
Electronic packaging
Lead free solders |
| Issue Date: | Mar-2008 |
| Publisher: | Universiti Malaysia Perlis |
| Department: | School of Materials Engineering |
| Abstract: | Many issue related to the performance of lead free solder alloys have arisen. So, it
should be take concern on it and one of the method is by studying the microstructure of
those solder alloys. This because their mechanical properties also depend on the
microstructure and also the stability of the microstructure. A comprehensive understanding of the process microstructure property relationships is essential. Toward
that goal, lead free solder alloy candidates such Sn-3.0Ag-0.5C was studied in their
microstructure because a comprehensive understanding of the microstructure is still
lacking. Ternary alloy such Sn-3.0Ag-0.5Cu is one of the most promising lead free
solder alloy for reflow soldering. A microstructure analysis is performed by using
digital microscopy. A detailed microstructure characterization with respect to phase compositions has been done by using SEM-EDX. From these study, the influence of
alloying element such Cu will effect in microstructure and its mechanical properties.
The network microstructure of Sn-3.0Ag-0.5Cu consist of CuSn5 and AgSn in the matrix of the ß-Sn. The melting temperature range of this solder only can be as reference for selection of solder for its application. |
| Description: | Access is limited to UniMAP community. |
| URI: | http://hdl.handle.net/123456789/5506 |
| Appears in Collections: | School of Materials Engineering (FYP)
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