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Please use this identifier to cite or link to this item: http://dspace.unimap.edu.my:80/xmlui/handle/123456789/35717

Title: Modified corn cob filled chitosan biocomposite films
Authors: Chan, Ming Yeng
Salmah, Husseinsyah, Prof. Madya Ir. Dr.
Sam, Sung Ting, Dr.
???metadata.dc.contributor.url???: irsalmah@unimap.edu.my
stsam@unimap.edu.my
Keywords: Acrylic acid;Biocomposite;Chitosan;Corn cob;Films
Issue Date: Nov-2013
Publisher: Taylor and Francis Group, LLC.
Citation: Polymer - Plastics Technology and Engineering, vol. 52(14), 2013, pages 1496-1502
Abstract: The present work was investigated the effect of filler content and chemical modification on mechanical, thermal properties and morphology study of CS/CC biocomposite films. The acrylic acid was used as chemical modification of corn cob. The increasing of CC content has decreased the tensile strength and elongation at break, but increased the modulus of elasticity of CS/CC biocomposite films. The modified corn cob with acrylic acid (AA) has enhanced the tensile properties and thermal properties of CS/CC biocomposite films by improving the interfacial interaction. The chemical reaction between acrylic acid and corn cob was confirmed by Fourier transmission infrared (FTIR) and the improvement of interfacial bonding was proven by scanning electron microscopy.
Description: Link to publisher's homepage at http://www.tandfonline.com/
URI: http://www.tandfonline.com/doi/abs/10.1080/03602559.2013.820752#.U6Khv5SSyyo
http://dspace.unimap.edu.my:80/dspace/handle/123456789/35717
ISSN: 0360-2559
Appears in Collections:School of Bioprocess Engineering (Articles)
School of Materials Engineering (Articles)
Salmah Husseinsyah, Assoc. Prof. Ir. Dr.
Sam Sung Ting, Dr.

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