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Please use this identifier to cite or link to this item: http://dspace.unimap.edu.my:80/dspace/handle/123456789/3503

Title: Characterization of parasitic residual deposition on passivation layer in electronics nickel immersion gold process
Authors: Mohd Khairuddin, Md Arshad
Azman, Jalar
Ibrahim, Ahmad
Keywords: Electroless nickel immersion gold (ENIG);Electroless plating;Metal coating;Parasitic deposition;Electroless deposition
Issue Date: 2007
Publisher: Elsevier Science
Citation: Microelectronics Reliability, vol.47, 2007, pages 1120-11126.
Description: Link to publisher's homepage at www.elsevier.com/locate/microrel
URI: http://www.sciencedirect.com/science?_ob=ArticleURL&_udi=B6V47-4M1D0KK-1&_user=1659113&_coverDate=07%2F31%2F2007&_rdoc=1&_fmt=high&_orig=search&_origin=search&_sort=d&_docanchor=&view=c&_searchStrId=1553672756&_rerunOrigin=google&_acct=C000054070&_version=1&_urlVersion=0&_userid=1659113&md5=1fb77f161a6870e88296f8e356e66bb0&searchtype=a
http://www.elsevier.com/
http://hdl.handle.net/123456789/3503
Appears in Collections:School of Microelectronic Engineering (Articles)

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