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Title: The characterization of Al Bond pad surface treatment in Electroless Nickel Immersion Gold (ENIG) deposition
Authors: Mohd Khairuddin, Md Arshad
Azman, Jalar
Ibrahim, Ahmad
Ghazali, Omar
Keywords: Zincation;Electroless nickel immersion gold (ENIG);Under bump metallurgy (UBM);Integrated circuits;Aluminum oxide;Zinc oxide
Issue Date: 2007
Publisher: Science Publications
Citation: American Journal of Applied Sciences, vol. 4 (3), 2007, pages 133-141.
Abstract: This study reports a number of experiments that were designed to characterize aluminum bond pad surfaces prior to electroless nickel immersion gold (ENIG). In the ENIG process, aluminum bond pads need special treatment to achieve successful nickel deposition and provide reliable interconnection of under bump metallurgy in advanced packaging. During this treatment process, the aluminum pad was cleaned, activated and then coated with a layer of zinc. Systematic study was carried out to determine the best parameters, through multiple and various exposure times of the zincation process and zincation solution concentration effect on the Ni/Au surface roughness and aluminum dissolution rate on the bond pad during multiple zincation process. The ball shear strength was evaluated between eutectic 37Pb/63Sn solder ball and under bump metallurgy (UBM) interfaces across multiple zincation process. Scanning Electron Microscope (SEM), Energy Dispersive X-Ray (EDX), Atomic Force Microscopy (AFM), Focused Ion Beam (FIB) and ball shear tester were used as analytical tools. The results suggest that the multiple zincation process consistently produces a smoother surface of ENIG UBM and consequently provides a better shear strength.
Description: Link to publisher's homepage at http://scipub.org/scipub/index.php
URI: http://hdl.handle.net/123456789/2430
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ISSN: 1546-9239
Appears in Collections:School of Microelectronic Engineering (Articles)

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