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Title: Electrical reliability of different alloying content on copper alloy fillers in electrically conductive adhesives
Authors: Lin-Ngee, Ho
Teng, Fei Wu
Nishikawa, Hiroshi
Takemoto, Tadashi
Miyake, Koichi
Fujita, Masakazu
Ota, Koyu
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Keywords: Electrical reliability;Copper alloy filler;Cu-Ag
Issue Date: 2011
Publisher: Springer
Citation: Journals of Materials Science: Materials in Electronics, vol. 22 (7), 2011, pages 735-740
Abstract: The thermal stability and electrical reliability of electrically conductive adhesives (ECAs) filled with Cu fillers alloying with different amount of Ag and Mg (0.2-1.5 at.%), respectively, were studied by comparing their electrical resistivity under high temperature exposure at 125 and 85 °C/85% RH for 1,000 h. Results showed that the Cu-Ag filled ECAs were superior to Cu-Mg filled ECAs in terms of thermal stability during aging under high temperature exposure and high humidity condition. A final resistivity on the order of 10-4 -.cm could be maintained for Cu-Ag filled ECAs after aging at 125 °C for 1,000 h. Cu-Mg filled ECAs showed relatively high electrical resistivity compared to Cu-Ag filled ECAs. Resistivity of Cu-Mg filled ECAs increased rapidly over time during high temperature exposure at 125 °C except for Cu-0.5 at.% Mg filled ECA which was thermally stable after 400 h of aging. The ECAs in this study could withstand high temperature exposure at 125 °C better than aging under a combination of elevated temperature and high humidity at 85 °C/85% RH.
Description: Link to publisher's homepage at http://www.springerlink.com/
URI: http://www.springerlink.com/content/g4w54628l0428232/fulltext.pdf
ISSN: 0957-4522
Appears in Collections:School of Materials Engineering (Articles)

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