Browsing by Subject "Solders"
Now showing items 1-6 of 6
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Application of artificial intelligence for the determination of package parameters for a desired solder joint fatigue life
(Emerald Group Publishing, 2006)Purpose: Aims to present a finite element analysis based methodology for estimating the characteristic fatigue life of a solder joint interconnect under accelerated temperature cycling to predict the reliability performance ... -
Development of Lead-Free Sn-0.7Cu-Si3N4 composite solders
(Universiti Malaysia Perlis (UniMAP)School of Materials Engineering, 2013)Lead based solder have been widely used before science have proven lead as one of the hazardous substances which can harm the environment and human health. With the banning usage of lead based solder as interconnect, ... -
The effect of corrosion in acidic solution to the phase and microstructure of SAC305 solder
(Universiti Malaysia Perlis (UniMAP)School of Materials Engineering, 2016-06)The effect of corrosion to the phase and microstructure of solder Sn-3.0Ag-0.5Cu (SAC305) in 1.0 M HCl were investigated under polarized condition. The potentiodynamic polarization analysis was fixed at a scan rate of 2.5 ... -
Effect of current stressing on intermetallic formation and mechanical properties of lead free SAC solder and SAC/activated carbon composite solder joint
(Universiti Malaysia Perlis (UniMAP)School of Materials Engineering, 2016-06)This study will investigate the effects of current stressing on intermetallic compound growth and the mechanical properties of lead free SAC and SAC/Activated carbon solder composite solder joint for certain current ... -
Effect of polarization scan rate on the corrosion properties of SAC305 in acidic solution
(Universiti Malaysia Perlis (UniMAP)School of Materials Engineering, 2016-06)The corrosion behaviour of the Sn-3.0Ag-0.5Cu (SAC305) solder to the corrosion properties of alloys in an acidic solution were investigated under polarized conditions. The corrosion parameters including the current ... -
Electrical properties and thermal stability of Cu-P containing electrically conductive adhesives
(Universiti Malaysia Perlis, 2009-12-01)Electrically conductive adhesives (ECA) containing Cu-P and Cu as metallic filler, respectively, were studied in term of electrical properties and thermal stability. Both metallic fillers used in this study were prepared ...