Browsing by Subject "Soldering"
Now showing items 1-7 of 7
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The effect of Bi on the microstructure, electrical, wettability and mechanical properties of Sn-0.7Cu-0.05Ni alloys for high strength soldering
(Elsevier, 2019-10)This paper elucidated the effects of the Bi element (0 wt%, 0.5 wt% and 1.5 wt%) on the microstructure, electrical, wettability and mechanical properties of the Sn-0.7Cu-0.05Ni as a high strength solder. Besides using the ... -
Effect of current stressing on intermetallic formation and mechanical properties of lead free SAC solder and SAC/activated carbon composite solder joint
(Universiti Malaysia Perlis (UniMAP)School of Materials Engineering, 2016-06)This study will investigate the effects of current stressing on intermetallic compound growth and the mechanical properties of lead free SAC and SAC/Activated carbon solder composite solder joint for certain current ... -
Effect of Zinc additions on Sn-0.7Cu-0.05Ni lead free solder alloy
(Universiti Malaysia Perlis (UniMAP), 2017-06)This project is focusing on the effect of zinc additions on Sn-0.7Cu-0.05Ni lead free solder alloy. The additional of micro-alloying have been developed by using casting technique with different percentage of zinc which ... -
Fabrication and characterization of hybrid microwave assisted sintering Sn-0.7Cu + 1.0wt.% Si₃N₄ composite solder
(Universiti Malaysia Perlis (UniMAP)School of Materials Engineering, 2015)One of the leading choices in upgrading the properties of existing lead-free solder alloys is by composite technology approach, whereby high technical ceramic particles can be added into the solder alloy matrix. Accordingly, ... -
Isothermal aging affect to the growth of Sn-Cu-Ni-1 wt. % TiO2 composite solder paste
(Trans Tech Publications Ltd., 2016-07)This work investigated the effects of 1.0 wt. % TiO2 particles addition into Sn-Cu-Ni solder paste to the growth of the interfacial intermetallic compound (IMC) on Cu substrate after isothermal aging. Sn-Cu-Ni solder paste ... -
Temperature cycling analysis for ball grid array package using finite element analysis
(Emerald Group Publishing Limited, 2011)Purpose - The purpose of this paper is to discuss the capability of finite element analysis (FEA) in performing the virtual thermal cycling reliability test to evaluate the reliability of solder joints in a ball grid array ... -
Temperature cycling analysis for ball grid array package using finite element analysis
(Emerald Group Publishing Limited, 2011)Purpose – The purpose of this paper is to discuss the capability of finite element analysis (FEA) in performing the virtual thermal cycling reliability test to evaluate the reliability of solder joints in a ball grid array ...