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    • SAC-SIC : a new potential lead–free composite solder for green technology 

      Zawawi, Mahim; Sayyidah Amnah, Musa; Noraniza, Saud; Nurul Razliana, Abdul Razak (Universiti Malaysia Perlis (UniMAP), 2015-04-17)
      Recently, the development of Sn-Ag-Cu (SAC) has gain attention in electronic packaging industry due to its good reliability in the electronics application. The tin-silver-copper family of alloys has earned a great deal ...