Browsing by Author "Vairavan, Rajendaran"

Now showing items 1-13 of 13

    • 5mm × 5mm sized slug on high power LED stress and junction temperature analysis 

      Zaliman, Sauli, Dr.; Retnasamy, Vithyacharan; Fairul Afzal, Ahmad Fuad; Ehkan, Phaklen, Dr.; Vairavan, Rajendaran; Nazuhusna, Khalid (Trans Tech Publications (TTP), 2013)
      Conventional incandescent lamps are being replaced by high power light emitting diode as a lighting source due to it ascendancy in terms of physical size, performance, output and lifetime. Nevertheless, the reliability and ...

    • CuDia slug size variation analysis on heat dissipation of high power LED 

      Vairavan, Rajendaran; Retnasamy, Vithyacharan; Zaliman, Sauli, Dr. (Trans Tech Publications, 2014-01)
      The current advancement of LED has prompt thermal challenges from the packaging point of view. The reliability of the LED is significantly influenced by each of its packaging component. This paper presents the investigation ...

    • Cylindrical shape slug heat conduction numerical analysis using copper material 

      Zaliman, Sauli, Dr.; Retnasamy, Vithyacharan; Kamarudin, Hussin, Brig. Jen. Dato' Prof. Dr.; Vairavan, Rajendaran (AENSI Publications, 2013-10)
      High power light emitting diodes have the edge over the conventional lighting system in terms of efficiency, low energy consumption and long operational lifetime. Nevertheless, the heat dissipation issue of the high power ...

    • Heat dissipation analysis under natural convection condition on high power LED 

      Vairavan, Rajendaran; Zaliman, Sauli, Dr.; Retnasamy, Vithyacharan; Kamarudin, Hussin, Brig. Jen. Dato' Prof. Dr. (AENSI Publisher All rights reserved, 2013-10)
      As the technology downscales with superior power and increased package density, the thermal effects of the high power LED are significant. Thus, the operating junction temperature of the high power light emitting diodes ...

    • Heat sink fin number variation analysis on single chip high power LED 

      Zaliman, Sauli, Dr.; Vairavan, Rajendaran; Retnasamy, Vithyacharan (Trans Tech Publications, 2014-01)
      Thermal management of high power LED is crucial the reliability and performance of the LED affected by the heat produced during photon emission. Heat sinks are utilized to dissipate the heat and to lower the operating ...

    • High power LED heat dissipation analysis via copper diamond slug 

      Vairavan, Rajendaran; Zaliman, Sauli, Dr.; Retnasamy, Vithyacharan; Kamarudin, Hussin, Brig. Jen. Dato' Prof. Dr. (AENSI Publisher All rights reserved, 2013-10)
      The emergence of high power light emitting diode as a novel electronic based light source is due to its vast advantage in terms of optical efficacy, low power consumption and enhanced life time. However, the performances ...

    • LED heat dissipation analysis using composite based cylindrical slug 

      Zaliman, Sauli, Dr.; Vairavan, Rajendaran; Retnasamy, Vithyacharan (Trans Tech Publications Inc., 2014-02)
      The optical efficacy and reliability of light emitting diode is extensively influenced by the operating junction temperature of the LED. Therefore, the evaluation of junction temperature is significant. This paper reports ...

    • LED heat dissipation study using different Cu slug size 

      Vairavan, Rajendaran; Retnasamy, Vithyacharan; Zaliman, Sauli, Dr.; Kamarudin, Hussin, Brig. Jen. Dato' Prof. Dr. (AENSI Publisher All rights reserved, 2013-10)
      High power light emitting diodes (LEDs) have significant contribution in illumination industry due exceptional advantages in terms of low power consumption, superior reliability, prolonged life time and high efficiency. ...

    • Natural heat convection analysis on cylindrical Al slug of LED 

      Vairavan, Rajendaran; Zaliman, Sauli, Dr.; Retnasamy, Vithyacharan; Khairul Anwar, Mohamad Khazali; Nooraihan, Abdullah; Nazuhusna, Khalid (Trans Tech Publications, 2014-01)
      This paper presents the characterization of a single chip high power LED package through simulation. Ansys version 11 was used for the simulation. The characterization of the LED package with aluminum cylindrical heat slug ...

    • Operating temperature analysis of LED with cylindrical Cu slug 

      Vairavan, Rajendaran; Zaliman, Sauli, Dr.; Retnasamy, Vithyacharan (Trans Tech Publications, 2014-01)
      High power light emitting diodes is the new era of lighting due to momentous supremacy in terms of lighting efficacy over traditional lighting systems. The reliability of LED is dependent on its junction temperature. This ...

    • Shear speed analysis on Sn-3.9Ag-0.6Cu Solder 

      Zaliman, Sauli, Dr.; Retnasamy, Vithyacharan; Fairul Afzal, Ahmad Fuad; Ehkan, Phaklen, Dr.; Ong, Tee Say; Vairavan, Rajendaran (Trans Tech Publications (TTP), 2013)
      Ball Grid Array (BGA) is a type of semiconductor interconnection used in Integrated Circuit (IC) which is being scaled down to micro and nano size. The reliability of BGA in IC becomes a concern as the size of IC reduces. ...

    • Wire bond shear test simulation 

      Vairavan, Rajendaran; Zaliman, Sauli, Dr.; Retnasamy, Vithyacharan; Taniselass, Steven; Wan Mokhzani, Wan Norhaimi (Universiti Malaysia Perlis (UniMAP), 2012-06-18)
      Wire bond shear test are utilized to appraise the reliability and the bond strength of wire bonded packages.In this study, a three-dimensional non linear finite element model was designed to simulate the stress response ...

    • Wire bond shear test simulation on sharp groove surface bond pad 

      Zaliman, Sauli, Dr.; Retnasamy, Vithyacharan; Taniselass, Steven; Ahmad Husni, Mohd Shapri; Vairavan, Rajendaran (Trans Tech Publications, 2012-12)
      Wire bonding process is first level interconnection technology used in the semiconductor packaging industry. The wire bond shear tests are used in the industry to examine the bond strength and reliability of the bonded ...