Browsing by Author "S., Jasmee"

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Thermo-mechanical and adhesion performance of Silver-Filled Conductive Polymer Composite (SFCP) using Thermoplastic Polyurethane (TPU) Substrate

A. S., Ashikin; G., Omar; N., Tamaldin; S., Jasmee; H. A., Hamid; A., Jalar; F., Che Ani (Universiti Malaysia Perlis (UniMAP), 2020-05)

Emerging of conductive metal filler in nanoscale like Silver-Filled Conductive Polymer Composite (SFCP) ink is one of the important technology for electronic interconnects future. Among the key challenges in the successful ...