Browsing by Author "Kulkarni, Venkatesh M."

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    • Flow analysis for flip chip underfilling process using characteristic based split method 

      Kulkarni, Venkatesh M.; Seetharamu, Kankanhally N.; Aswatha Narayana, P. A.; Ishak, Abdul Azid, Dr.; Ghulam, Abdul Quadir, Prof. Dr. (IEEE Conference Publications, 2004)
      In this paper, an effort has made to analyze and numerically simulate the fluid flow in chip cavity using characteristic based split (CBS) method. Simulation methodology includes a solver for the fluid flow equations coupled ...

    • Numerical simulation of underfill encapsulation process based on characteritsic split method 

      Kulkarni, Venkatesh M.; Seetharamu, Kankanhally N.; Ishak, Abdul Azid, Dr.; Aswatha Narayana, P. A.; Ghulam, Abdul Quadir, Prof. Dr. (John Wiley & Sons, Inc., 2006)
      Electronic packaging protects the integrated circuit chip from environmental and mechanical damages. Underfilling encapsulation is an electronic packaging technology used to reinforce the solder joints between chip and the ...