Browsing by Author "J., Chaiprapa"
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The effect of Bi on the microstructure, electrical, wettability and mechanical properties of Sn-0.7Cu-0.05Ni alloys for high strength soldering
Mohd Izrul Izwan, Ramli; Mohd Arif Anuar, Mohd Salleh; H., Yasuda; J., Chaiprapa; K., Nogita (Elsevier, 2019-10)This paper elucidated the effects of the Bi element (0 wt%, 0.5 wt% and 1.5 wt%) on the microstructure, electrical, wettability and mechanical properties of the Sn-0.7Cu-0.05Ni as a high strength solder. Besides using the ...