Browsing by Author "Ibrahim, Ahmad"
Now showing items 1-8 of 8
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The characterization of Al Bond pad surface treatment in Electroless Nickel Immersion Gold (ENIG) deposition
Mohd Khairuddin, Md Arshad; Azman, Jalar; Ibrahim, Ahmad; Ghazali, Omar (Science Publications, 2007)This study reports a number of experiments that were designed to characterize aluminum bond pad surfaces prior to electroless nickel immersion gold (ENIG). In the ENIG process, aluminum bond pads need special treatment ... -
Characterization of parasitic residual deposition on passivation layer in electronics nickel immersion gold process
Mohd Khairuddin, Md Arshad; Azman, Jalar; Ibrahim, Ahmad (Elsevier Science, 2007) -
Dicing die attach film for 3D stacked die QFN packages
Shahrum, Abdullah; S., Mohd Yusof; Ibrahim, Ahmad; Azman, Jalar; Ruslizam, Daud, Dr. (IEEE Conference Publications, 2012)The application of die attach film (DAF) in semiconductor packaging is become wider especially in three dimensional (3D) QFN stacked die package. As wafer getting thinner until beyond 100 μm, challenges in die attach process ... -
The effect of temperature, pH and exposure time to Electroless Nickel Deposition for Under Bump Metallurgy (UBM)
Mohd Khairuddin, Md Arshad; Ibrahim, Ahmad; Azman, Jalar; Uda, Hashim (Universiti Putra Malaysia (UPM), 2005-12-06)The low cost deposition of under bump metallurgy (UBM) method presented in this paper is based on electroless nickel immersion gold (ENIG) bumping process. The study is focuses on the effect of temperature, pH and exposure ... -
The effects of multiple zincation process on Aluminum Bond Pad surface for Electroless Nickel Immersion Gold deposition
Mohd Khairuddin, Md Arshad; Ibrahim, Ahmad; Azman, Jalar; Ghazali, Omar; Uda, Hashim (American Society of Mechanical Engineers (ASME), 2006-09)This paper reports the effects of a multiple zincation processon the Al bond pad surface prior to electroless nickel immersion gold deposition. The study of multiple zincation comprises the surface topogtaphy and morphology ... -
Simulasi Fabrikasi Simpangan Cetek Ultra menggunakan Resapan Dopan daripada SOD (Spin On Dopant)
Uda, Hashim; Nik Hazura, Nik Hamat; Fauziyah, Salehuddin; Ibrahim, Ahmad; Sutikno Madnasri (Universiti Malaysia Perlis, 2006)Pembentukan simpangan cetek ultra merupakan suatu proses yang kritikal dalam fabrikasi peranti-peranti submikron bagi teknologi litar terkamil pada masa hadapan. Di dalam penulisan ini, simulasi proses pembentukan simpangan ... -
A study for optimum productivity yield in 0.16μm mixed of wafer fabrication facility
Mohd Azizi, Chik; Ve, Chun Yung; Balakrishna, Puvaneswaran; Uda, Hashim, Prof. Dr.; Ibrahim, Ahmad; Bashir, Mohamad (Institute of Electrical and Electronics Engineers (IEEE), 2010-06-28)This research is to study the opportunity to achieve optimum productivity yield in 0.16μm product mixed through understanding the impact of loading utilization towards the capacity. The study is important to model the ... -
The surface characteristics of under bump metallurgy (UBM) in electroless nickel immersion gold (ENIG) deposition
Mohd Khairuddin, Md Arshad; Ibrahim, Ahmad; Azman, Jalar; Ghazali, Omar (Elsevier Science, 2006)This paper discusses on the surface characteristics of each of the seven set-up process steps prior completion of under bump metallurgy (UBM) deposition. The Atomic Force Microscopy (AFM) and Scanning Electron Microscopy ...