Browsing by Author "B., L. Chan"
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Technical barriers and development of Cu wirebonding in nanoelectronics device packaging
C., L. Gan; E., K. Ng; B., L. Chan; Uda, Hashim, Prof. Dr.; F., C. Classe (Hindawi Publishing Corporation, 2012)Bondpad cratering, Cu ball bond interface corrosion, IMD (intermetal dielectric) cracking, and uncontrolled post-wirebond staging are the key technical barriers in Cu wire development. This paper discusses the UHAST (unbiased ...